Lead Application Engineer (Digital IC Implementation)

TL;DR

Lead Application Engineer (Digital IC Implementation): Managing technical evaluations and scoping opportunities for the hirify.global DSG platform with an accent on digital IC implementation and ICD back-end technologies. Focus on executing complex signoff projects, including floorplanning, STA, and routing, to ensure client success.

Location: Gyeonggi-do (Seoul), South Korea

Company

Leading provider of electronic design automation (EDA) software and hardware for semiconductor and system design.

What you will do

• Identify and scope technical opportunities for the hirify.global DSG platform in collaboration with sales teams.
• Plan, execute, and manage key technical evaluations by working proactively with existing and potential customers.
• Provide expert-level technical support to address complex client queries regarding ICD back-end technologies.
• Conduct basic and advanced technical trainings, presentations, and product demonstrations.
• Mentor and ramp up team members on advanced ICD back-end tools and technologies.

Requirements

• 6+ years of experience in digital IC implementation (floorplan, power-plan, placement, CTS, routing, SI & STA signoff).
• Proficiency in Linux and tcl.
• Experience with SOC-E, STA (ETS or PrimeTime-SI), RC extraction, and LEF generation.
• Strong program and engagement management skills.
• Good command of English (written and oral).
• Must be based in Gyeonggi-do/Seoul, South Korea.

Nice to have

• Hands-on experience with advanced processes below with hierarchical, timing-driven, SI prevention, and low-power place-and-route projects.